Mission to be the leading supplier of thermal processing solutions to China and global electronics and materials markets, form 1992 , HengLi provides products and service to diverse markets such as Microelectronic Packaging market, which include IC, SMT, HIC, MCM and MEMS applications. As well as Advanced Materials markets, which include thick film, electronic component, photovoltaic cell, ceramics and metals processing applications. In addition, we manufacture Surface Treatment facility for electronic and military market and   custom systems for specific customer applications.